M07700 - SEMI M77 - Test Method for Determining Wafer Near-Edge Geometry Using Roll-Off Amount, ROA Revision:SEMI M77-1015 (Reapproved 0421) - Current SEMI F45-0307 (Reapproved 0818)

SEMI F45-0307 (Reapproved 0818)

and end-users

This Test Method also describes use of a transfer sensor that is calibrated using a calorimeter and a working sensor that is calibrated using the transfer sensor

SEMI M8-1296 (technical revision)

SEMI G18 — Specification for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes

M07700 - SEMI M77 - Test Method for Determining Wafer Near-Edge Geometry Using Roll-Off Amount, ROA Revision:SEMI M77-1015 (Reapproved 0421) - Current SEMI F45-0307 (Reapproved 0818)Wafer near edge geometry can significantly affect the yield of semiconductor device processing. Knowledge of near edge geometrical properties can help the producer and consumer determine if the dimensional characteristics of a specimen wafer satisfy given geometrical requirements. The roll off amount (ROA) metric is suitable for quantifying near edge geometry of wafers used in semiconductor device processing. Consideration should be given to the use