E07000 - SEMI E70 - Guide for Tool Accommodation Process StdPbc-1021 SEMI MF657 — Test Method

SEMI MF657 — Test Method for Measuring Warp and Total Thickness Variation on Silicon Slices and Wafers by a Noncontact Scanning Method

By doing a separate analysis

This interface is not intended to provide high repeatability or rapid removal (both of which can be provided by other couplings in the box opener/loader unit)

This Standard establishes a Prober Specific Equipment Model for prober equipment deployed in a factory adhering to the Global Joint Guidance for 300 mm Standards (PSEM300)

本文書は，自動および手動での基板搬送についてホストが情報を知り，その役割を果たし易くするスタンダードを定義するものである。また，製造装置における材料処理を制御するために有用になることも意図としている。具体的には，以下の内容を提供する。

E07000 - SEMI E70 - Guide for Tool Accommodation Process StdPbc-1021 SEMI MF657 — Test MethodThis Guide provides an overview of the various elements of Tool Accommodation, a methodology by which semiconductor processing equipment is installed in a cost effective and timely manner. This addition to the SEMI Tool Accommodation Standards set describes the process by which the referenced SEMI Standards can be effectively used to achieve tool installation cost and schedule goals. This overview Guide provides process development, facilities,