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SEMI M49 — Guide for Specifying Geometry Measurement Systems for Silicon Wafers for the 130 nm to 16 nm Technology Generations
the user of this Document can generate specifications for silicon annealed wafers
SEMI 3D15-0316 (first published)
SEMI MF42-0316 (Reapproved 0921)
Analysis of the surface or surface near regions of samples may be performed according to the test method by additional sample preparation and avoiding carefully surface contamination during sample extraction
MF092800 - SEMI MF928 - Test Method for Edge Contour of Circular Semiconductor Wafers and Rigid Disk Substrates StdPbc-0317 SEMI M49 — Guide forThe edges of circular wafers of electronic materials are frequently required to be shaped after cutting the wafers from the ingot. Contouring the wafer edge reduces the incidence of chipping and minimizes epitaxial edge crown and photoresist edge bead during subsequent processing of the wafer. Similarly, edges of rigid disk substrates are frequently edge shaped. This Test Method described here provide means to determine that the wafer edge contour is
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