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The scope of this Standard is limited to the usage and description of AMHS storage equipment (Stockers) as perceived by a SEMI Equipment Communications Standard 2 (SECS-II) host that complies with the GEM model (as specified in § 13)
This Test Method defines a procedure for the evaluation of die strength by the mean of 3-point bending method
SEMI MF1708 — Practice for Evaluation of Granular Polysilicon by Melter-Zoner Spectroscopies
SEMI MF154-0305 (technical revision)
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M07300 - SEMI M73 - Test Method for Extracting Relevant Characteristics from Measured Wafer Edge Profiles Revision:SEMI M73-0125 - Current The scope of this Standard1 Purpose 1. 1 SEMI M1 specifies the contour of the shaped edge of silicon wafers by using templates that allow a wide variation in wafer edge profiles manufactured by silicon suppliers to still meet the specification. 1. 2 In many advanced wafer applications, a much tighter specification of the edge profile is required to control variations in subsequent circuit processing. These specifications frequently include values for certain characteristics
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