E13800 - SEMI E138 - Specification for XML Semiconductor Common Components Revision:SEMI E138-0309 - Superseded SEMI G9 — Specification for

SEMI G9 — Specification for Stamped Leadframes for Plastic Molded Dual-In-Line Semiconductor Packages

quality control

本仕様は，半導体産業で使用する装置のための電圧サグ対応力の最低限の設計要求を設定する。対応力は，電圧サグデプス（サグの間に残っている公称電圧の割合）および電圧サグ継続時間（サイクルまたは秒）で規定する。本仕様は，調達に関する要求事項，試験方法，合否基準，および試験報告に関する要求事項についても定める。

and phosphoric etchants

SEMI E172-0115 (first published)

E13800 - SEMI E138 - Specification for XML Semiconductor Common Components Revision:SEMI E138-0309 - Superseded SEMI G9 — Specification forThis Document is a central location for the definition of common XML elements that are not specific to a single standard, but common across multiple standards. This Document defines the representation of Error, Data Types, Data Value Types, and Unit which are considered common components. The common components are used in association with other XML documents or schemas generated as part of the XML based SEMI Standard Interface Specifications.