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as technology advances to smaller and smaller dimensions for the elements of high-density integrated circuits
It does not apply to communication that is governed by the SEMI E30 communication and control state models
SEMI E35-0200 (technical revision)
Purge efficacy with a non-interactive gas using manufacturers’ standard purge sequence
SEMI E83-0714 (technical revision)
M03800 - SEMI M38 - Specification for Polished Reclaimed Silicon Wafers Revision:SEMI M38-0312 (Reapproved 1023) - Current as technology advances to smallerThis Specification divides reclaimed wafers into four application categories: Mechanical, Furnace, Particle, and Lithography and provides tables of the specification requirements for each category. Thus, a prospective purchaser of reclaimed silicon wafers needs to know which application matches his or her requirements. Only requirements for some attributes are specified in Tables 1 and 2. Other requirements are indicated to be customer specified which
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